Data Sheet

ADV7610

Rev. 0 | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

DVDD to GND

2.2 V

PVDD to GND

2.2 V

DVDDIO to GND

4.0 V

CVDD to GND

2.2 V

TVDD to GND

4.0 V

Digital Inputs Voltage to GND

GND − 0.3 V to DVDDIO + 0.3 V

5 V Tolerant Digital Inputs to

GND1

5.3 V

Digital Outputs Voltage to GND

GND − 0.3 V to DVDDIO + 0.3 V

XTALP, XTALN

GND − 0.3 V to PVDD + 0.3 V

SCL/SDA Data Pins to DVDDIO

DVDDIO − 0.3 V to

DVDDIO + 3.6 V

Maximum Junction Temperature

125°C

Storage Temperature Range

−60°C to +150°C

Infrared Reflow Soldering (20 sec)

260°C

1

The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL, DDCA_SDA,

and RXA_5V.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

PACKAGE THERMAL PERFORMANCE

To reduce power consumption when using the ADV7610, turn

off the unused sections of the part.

Due to the PCB metal variation and, therefore, variation in PCB

The most efficient measurement solution is obtained using the

package surface temperature to estimate the die temperature

125°C. The following equation calculates the junction temperature

using the measured package surface temperature, and it applies

only when a heat sink is not used on the device under test (DUT):

where:

where 0.05 is 5% of the TVDD power that is dissipated on the

device itself.

ESD CAUTION