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M54HCT240 数据表(PDF) 19 Page - STMicroelectronics |
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M54HCT240 数据表(HTML) 19 Page - STMicroelectronics |
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19 / 29 page ![]() M54HCxxx - M54HCTxxx Package mechanical data Doc ID 17367 Rev 2 19/29 Figure 7. Ceramic DIL-24 package drawings Note: The upper metallic lid is not electrically connected to any pins, nor to the IC die inside the package. Connecting unused pins or metal lid to ground or to the power supply will not affect the electrical characteristics. Table 12. Ceramic DIL-24 package dimensions Dim. mm. Min. Typ. Max. A 2.159 1.931 2.387 a1 1.270 1.016 1.524 a2 .307 .274 .340 B 1.270 b1 0.457 0.407 0.507 b2 .254 0.229 0.304 C 2.466 2.205 2.727 D 30.48 30.17 30.78 E 15.24 14.98 15.49 e 2.540 2.410 2.670 e3 27.94 27.81 28.06 F 15.11 14.85 15.36 K 12.80 12.60 13.00 K1 12.80 12.60 13.00 L 3.300 3.000 3.800 |
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