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LSM303DLHC 数据表(PDF) 40 Page - STMicroelectronics |
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LSM303DLHC 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 43 page ![]() Package information LSM303DLHC 40/42 Doc ID 018771 Rev 1 8 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions, and product status are available at: www.st.com. ECOPACK is an ST trademark. Figure 5. LGA-14: mechanical data and package dimensions Dimens ions Ref. mm Min. Typ. Max. A1 1 A2 0.785 A3 0.16 0.2 0.24 D1 2.85 33.15 E1 4.8555.15 N1 0.8 L1 4 T1 0.8 T2 0.5 M 0.1 k 0.05 LGA 3x5x1 14L Land Grid Array Package Outline and 8265271_A mechanic al data |
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