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REF03GPZ 数据表(PDF) 15 Page - Analog Devices |
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REF03GPZ 数据表(HTML) 15 Page - Analog Devices |
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15 / 20 page ![]() REF01/REF02/REF03 Rev. K | Page 15 of 20 TEMPERATURE MONITORING In addition to the optional TRIM function, the REF0x series of references provides the ability to monitor changes in temper- ature by way of tracking the voltage present at the TEMP pin. The output voltage of this pin is taken directly from the band gap core and, as a result, varies linearly with temperature. The nominal voltage at the TEMP pin (VTEMP) is approximately 550 mV at 25°C, with a temperature coefficient (TCVTEMP) of approximately 1.96 mV/°C. Refer to Figure 32 for a graph of output voltage vs. temperature. As an example, given these ideal values, a voltage change of 39.2 mV at the TEMP pin corresponds to a 20°C change in temperature. The TEMP function is provided as a convenience, rather than a precise feature, of the reference. In addition, because the voltage at the TEMP pin is taken directly from the band gap core, any current injected into or pulled from this pin has a significant effect on VOUT. As such, even tens of microamps drawn from the TEMP pin can cause the output to fall out of regulation. Should the designer wish to take advantage of this feature, it is neces- sary to buffer the output of the TEMP pin with a low bias current op amp, such as the AD8601 or AD8641. Any of these op amps, if used as shown in Figure 36, causes less than a 100 μV change in VOUT. U2 15V U1 VIN VOUT TEMP TRIM GND VO V– V+ AD8641 VTEMP 1.9mV/°C VIN REF01/ REF02/ REF03 Figure 36. Temperature Monitoring LONG-TERM STABILITY One of the key parameters of the REF0x series of references is long-term stability. Regardless of output voltage, internal testing during development showed a typical drift of approximately 50 ppm after 1,000 hours of continuous, nonloaded operation in a +25°C environment. It is important to understand that long-term stability is not guaranteed by design, and that the output from the device may shift beyond the typical 50 ppm specification at any time, especially during the first 200 hours of operation. For systems that require highly stable output over long periods of time, the designer should consider burning-in the devices prior to use to minimize the amount of output drift exhibited by the reference over time. Refer to the AN-713 Application Note for more information regarding the effects of long-term drift and how it can be minimized. BURN-IN Burn-in, wherein the part is powered and allowed to operate normally for an extended period of time, can be useful for minimizing the effects of long-term drift. A sample burn-in circuit is shown below in Figure 37. VIN VOUT GND +18V –18V + 10µF + 10µF 10 Ω RL OPTIONAL REF01/ REF02/ REF03 Figure 37. Burn-In Circuit The part may be burned in with or without a constant resistive load. The load current should not exceed 10 mA. POWER DISSIPATION The REF0x series of voltage references are capable of sourcing up to 10 mA of load current at room temperature across the rated input voltage range. However, when used in applications subject to high ambient temperatures, the input voltage and load current should be carefully monitored to ensure that the device does not exceeded its maximum power dissipation rating. The maximum power dissipation of the device can be calculated via the following equation: [] W JA A j D θ T T P − = where: PD is device power dissipation. Tj is device junction temperature. TA is ambient temperature. θJA is package (junction-to-air) thermal resistance. Because of this relationship, acceptable load current in high- temperature conditions may be less than the maximum current-sourcing capability of the device. In no case should the part be operated outside of its maximum power rating as doing so may result in premature failure or permanent damage to the device. |
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