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ACT31 数据表(PDF) 1 Page - Advanced Crystal Technology |
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ACT31 数据表(HTML) 1 Page - Advanced Crystal Technology |
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1 / 2 page ![]() Tel: 0044 (0)118 979 1238 Fax: 0044 (0)118 979 1283 E-mail: info@actcrystals.com DC100V±15V In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice. ISO9001: 2000 Registered For quotations or further information please contact us at: 3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK http://www.actcrystals.com 120 max 100 max 80 max Please specify fo 9~10MHz fo 4.0~4.999MHz fo 5~5.999MHz fo 6~6.999MHz fo 7~8.999MHz 60 max ACT31 Specification Specification Symbol Parameter The ACT31 is a compact crystal resonator offering high vibration and shock resistance together with high stability. It is most suitable for portable equipment and close packing density. The device is offered with frequencies between 3.5 and 4.0MHz. Frequency Frequency Tolerance @25°C Frequency Stability 3.579545-10MHz ±10~50ppm (TYP ±30ppm) ±10~50ppm (TYP ±30ppm) fo f/fo f/fo Temp Operating Range Temp Storage Range Equivalent Series Resistance Shunt Capacitance Load Capacitance Drive Level Insulation Resistance Aging Topr Tstg ESR C0 -40 ~ +85°C Fa ±5ppm max CL 10~100 W ( 30W typ) 200 max 5.0pF typical 150 max DL IR Please note that all parameters can not necessarily be specified in the same device Customer to Specify : Frequency, Frequency Tolerance, Operating Temperature Range & Load Capacitance Condition Please specify fo 3.579545~3.999MHz Please specify 500M Min 16.0pF (Others available.) @ 25°C ±3°C 1 st year -10 ~ +70°C Issue : 4 C1b Date : 31-5-2012 SOLDERING of CYLINDER CRYSTALS Lead wire should be soldered within 5 seconds with the iron having a tip temperature of less than 270°C. Case must not exceed 150°C With regard to wave soldering it is recommended that the process is carried out with the crystal unit set upright on the circuit board. Should the process be carried out with the crystal unit on its side then steps must be taken to prevent heat transfer through the can. Should the whole crystal unit be heated (in a re-flow oven for example) it will result in amarked deterioration of the performance or even failure to oscillate. This is due to the internal construction of the crystal unit which involves the use of solder. Lead Surface Material +Cu, +Sn |
类似零件编号 - ACT31_12 |
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类似说明 - ACT31_12 |
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