Characteristics

STPS2L60-Y

4/7

Doc ID 018927 Rev 1

Figure 7.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 8.

Junction capacitance versus

reverse voltage applied

(typical values)

I (µA)

R

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

1.E+05

0

102030

405060

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =75°C

j

T =50°C

j

T =25°C

j

C(pF)

10

100

1000

110

100

F=1MHz

V

=30mV

T =25°C

OSC

j

V (V)

R

Figure 9.

Forward voltage drop versus

forward current

(maximum values, low level)

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under each lead

I

(A)

FM

0

1

2

3

4

5

6

7

8

9

10

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

R

(°C/W)

th(j-a)

0

10

20

30

40

50

60

70

80

90

100

110

120

130

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(Cu)(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm