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DSA30C200PB 数据表(PDF) 2 Page - IXYS Corporation |
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DSA30C200PB 数据表(HTML) 2 Page - IXYS Corporation |
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2 / 3 page ![]() DSA 30 C 200 PB advanced I RMS A per terminal 35 R thCH K/W 0.50 M D Nm 0.6 mounting torque 0.4 T stg °C 150 storage temperature -55 Weight g 2 Symbol Definition Ratings typ. max. min. Conditions RMS current thermal resistance case to heatsink Unit F C N 60 mounting force with clip 20 Ordering Delivering Mode Base Qty Code Key Standard Part Name DSA 30 C 200 PB 507014 Tube 50 XXXXXX YYWW Logo Marking on product DateCode Assembly Code abcdef Product Marking D S A 30 C 200 PB Part number Diode Schottky Diode low VF Common Cathode TO-220AB (3) = = = 1) Marking on Product DSA30C200PB Current Rating [A] Reverse Voltage [V] = = = = 1) I RMS is typically limited by the pin-to-chip resistance (1) ; or by the current capability of the chip (2) . In case of (1) and a common cathode/anode configu ration with a non-isolated ba ckside, the current capability can be increased by connecting the backside. IXYS reserves the right to change limits, conditions and dimensions. 20100628 Data according to IEC 60747and per diode unless otherwise specified © 2010 IXYS all rights reserved |
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