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STM32F103C4 数据表(PDF) 76 Page - STMicroelectronics |
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STM32F103C4 数据表(HTML) 76 Page - STMicroelectronics |
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76 / 90 page ![]() Package characteristics STM32F103x4, STM32F103x6 76/90 Doc ID 15060 Rev 6 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead solder joint life. Figure 38. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package outline(1) Figure 39. Recommended footprint (dimensions in mm)(1)(2) Seating plane ddd C C A3 A1 A A2 Pin # 1 ID R = 0.20 ZR_ME E2 b 19 10 18 27 28 36 19 D2 E D e L 0.30 6.30 0.50 1.00 4.30 4.30 4.80 4.80 4.10 4.10 1 28 9 19 ai14870b 36 27 18 10 0.75 Table 51. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.800 0.900 1.000 0.0315 0.0354 0.0394 A1 0.020 0.050 0.0008 0.0020 A2 0.650 1.000 0.0256 0.0394 A3 0.250 0.0098 b 0.180 0.230 0.300 0.0071 0.0091 0.0118 D 5.875 6.000 6.125 0.2313 0.2362 0.2411 D2 1.750 3.700 4.250 0.0689 0.1457 0.1673 E 5.875 6.000 6.125 0.2313 0.2362 0.2411 E2 1.750 3.700 4.250 0.0689 0.1457 0.1673 e 0.450 0.500 0.550 0.0177 0.0197 0.0217 L 0.350 0.550 0.750 0.0138 0.0217 0.0295 ddd 0.080 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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