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STM32F415OG 数据表(PDF) 131 Page - STMicroelectronics |
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STM32F415OG 数据表(HTML) 131 Page - STMicroelectronics |
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131 / 186 page ![]() DocID022063 Rev 4 131/186 STM32F415xx, STM32F417xx Electrical characteristics Equation 1: RAIN max formula The formula above (Equation 1) is used to determine the maximum external impedance allowed for an error below 1/4 of LSB. N = 12 (from 12-bit resolution) and k is the number of sampling periods defined in the ADC_SMPR1 register. tCONV(4) Total conversion time (including sampling time) fADC = 30 MHz 12-bit resolution 0.50 - 16.40 µs fADC = 30 MHz 10-bit resolution 0.43 - 16.34 µs fADC = 30 MHz 8-bit resolution 0.37 - 16.27 µs fADC = 30 MHz 6-bit resolution 0.30 - 16.20 µs 9 to 492 (tS for sampling +n-bit resolution for successive approximation) 1/fADC fS(4) Sampling rate (fADC = 30 MHz, and tS = 3 ADC cycles) 12-bit resolution Single ADC - - 2 Msps 12-bit resolution Interleave Dual ADC mode - - 3.75 Msps 12-bit resolution Interleave Triple ADC mode - - 6 Msps IVREF+(4) ADC VREF DC current consumption in conversion mode -300 500 µA IVDDA(4) ADC VDDA DC current consumption in conversion mode -1.6 1.8 mA 1. VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section : Internal reset OFF). 2. It is recommended to maintain the voltage difference between VREF+ and VDDA below 1.8 V. 3. VDDA -VREF+ < 1.2 V. 4. Based on characterization, not tested in production. 5. VREF+ is internally connected to VDDA and VREF- is internally connected to VSSA. 6. RADC maximum value is given for VDD=1.8 V, and minimum value for VDD=3.3 V. 7. For external triggers, a delay of 1/fPCLK2 must be added to the latency specified in Table 67. Table 67. ADC characteristics (continued) Symbol Parameter Conditions Min Typ Max Unit RAIN k0.5 – () fADC CADC 2 N 2 + () ln × × -------------------------------------------------------------- RADC – = |
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