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HSP061-2 数据表(PDF) 5 Page - STMicroelectronics |
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HSP061-2 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() HSP061-2 Package information Doc ID 022777 Rev 1 5/12 3 Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT-666 dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 0.27 0.34 0.007 0.011 0.013 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 e0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 L3 0.10 0.004 Figure 11. Footprint recommendations dimensions in mm (inches) Figure 12. Marking D b L3 L1 e b1 E1 L2 E A A3 0.50 (0.019) 2.60 (0.01) 0.62 (0.024) 0.30 (0.012) 0.99 (0.039) R |
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