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MMZ2012Y202B 数据表(PDF) 27 Page - TDK Electronics |
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MMZ2012Y202B 数据表(HTML) 27 Page - TDK Electronics |
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27 / 29 page ![]() • All specifications are subject to change without notice. (26/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ1005-E FEATURES • Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Electroplated terminal electrodes accommodate reflow soldering. • High reliability due to an entirely monolithic structure. • Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. • Low DC resistance structure of electrode prevents wasteful electric power consumption. • It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. SPECIFICATIONS SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN ELECTRICAL CHARACTERISTICS Test equipment: E4991A or equivalent Test tool : 16192A or equivalent Test temperature: 25±10°C PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L W (3) Type name (4) Impedance 601:600 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code PACKAGING STYLE AND QUANTITIES HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Part No. Impedance( ) DC resistance ( )max. Rated current (mA)max. [100MHz] [1GHz] MMZ1005S601E 600±25% 1000±40% 0.65 300 MMZ1005S102E 1000±25% 1400±40% 1.00 250 MMZ1005S182E 1800±25% 1800±40% 1.50 200 MMZ1005A601E 600±25% 1400±40% 0.80 300 MMZ1005A102E 1000±25% 2000±40% 1.20 250 MMZ1005A152E 1500±25% 2300±40% 1.60 230 MMZ1005A182E 1800±25% 2700±40% 2.10 200 MMZ1005A222E 2200±25% 3000±40% 2.20 150 MMZ1005D121E 120±25% 1000±40% 0.70 300 MMZ1005D221E 220±25% 1700±40% 1.00 250 MMZ1005F470E 47±25% 800±40% 0.70 300 MMZ1005F750E 75±25% 1500±40% 1.00 250 MMZ1005F121E 120±25% 2300±40% 1.50 200 0.1min. 1 ±0.05 0.4 0.5 0.5 Weight: 1mg Dimensions in mm MMZ 1005 S 601 E T (1) (2) (3) (4) (5) (6) (7) Packaging style Quantity Taping 10000 pieces/reel Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. |
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