3

Absolute Maximum Ratings

These are stress ratings only and functional operation is not implied

Exposure to absolute

maximum ratings for prolonged time periods may affect device reliability

All voltages are with

respect to ground

.

.

.

Input Voltage..................................-0.3V to 6.5V

EN, FB Pin Voltage.............................-

SW Pi n Voltage.....................-

0.3V to V

0.3V to

V +0.3V

Junction Temperature................................150°C

Storage Temperature Range........-65°C to 150°C

Soldering Temperature......................300°C 5sec

(

)

IN

IN

,

Recommended Operating Conditions

Supply Voltage................................2.5V to 5.5V

°C

°C

°C

°C

Operation Temperature Range.........-40

to 85

Junction Temperature Range........-40

to 125

Thermal Information

Parameter

Symbol

Package

Maximum

Unit

Thermal Resistance

(Junction to Case)

θ

JC

TDFN3X3-10

8.5

°C/W

Thermal Resistance

(Junction to Ambient)

θ

JA

TDFN3X3-10

60

Internal Power Dissipation

TDFN3X3-10

1.66

W

,

Power Analog Microelectronics Inc

www.poweranalog.com

PAM2321

3MHz,Fast Transient 2A Step-Down Converter

Name

Function

PGND

Main power ground return pin. Connect to the output and input capacitor return.

PVIN

Input power supply tied to the source of the high side P-channel MOSFET.

VIN

Power supply; supplies power for the internal circuitry.

FB

Feedback input pin. This pin is connected directly to the converter output for the 1.2V fixed

output version, or connected to an external resistor divider for the adjustable output version.

AGND

Analog ground. This pin is internally connected to the analog ground of the control circuitr y.

EN

Enable pin. A logic low disables the converter and it consumes less than 1µA of current. When

connected high, it resumes normal operation.

SW

Switching node. Connect the inductor to this pin. It is internally connected to the drain of both

high and low side MOSFETs.

EP

Exposed pad of the package provides both electrical contact to the ground and good thermal

contact to the PCB. This pad must be soldered to the PCB for proper operation.

Pin Description

01/2013 Rev1.2