M24C02-R datasheet(37/38 Pages) STMICROELECTRONICS

37 / 38 page

M24C16, M24C08, M24C04, M24C02, M24C01

Revision history

Doc ID 5067 Rev 17

37/38

29-Apr-2010

Deleted TSSOP8 3x3 mm package from cover page.

Deleted Figure and Table relating to TSSOP8 3x3 mm package

information.

Deleted line and note in Table 24: Ordering information scheme concerning

TSSOP8 3x3 mm package.

In Table 26: Available M24C08 products (package, voltage range,

temperature grade) updated UFDFPN8 (MC) package for M24C08-F range

to 5 and deleted line concerning TSSOP8 3x3 mm package.

In Table 27: Available M24C04 products (package, voltage range,

temperature grade) updated UFDFPN8 (MC) package for M24C08-F range

to 5.

In Table 28: Available M24C02 products (package, voltage range,

temperature grade) updated UFDRPN8 options to MB or MC.

15-Apr-2011

Updated:

- Text modified in Section 2.3: Chip Enable (E0, E1, E2).

- Text modified in Section 3.6: Write operations.

- VESD minimum value deleted ofTable 5: Absolute maximum ratings.

- Figure 15: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package

no lead 2 x 3 mm, outline.

- E2 (Rev MC): “ddd” has been changed to “eee” and its values modified in

Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no

lead 2 x 3 mm, data.

Added:

- Note at the end of the Section 1: Description.

- Figure footnote below the Figure 3: WLCSP and thin WLCSP connections

(top view, marking side, with balls on the underside).

Date

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