MCP4641 datasheet(97/102 Pages) MICROCHIP

97 / 102 page

 2008-2012 Microchip Technology Inc.

DS22107B-page 97

MCP454X/456X/464X/466X

APPENDIX A:

REVISION HISTORY

Revision B (February 2013)

The following is the list of modifications:

Updated the DFN package pinout on page 1.

Updated the Absolute Maximum Ratings† page

format and added Total Power Dissipation

values for each package type.

Updated the typical thermal package resistance

values for the 8L-DFN (3x3) and 8L-SOIC pack-

ages in the Temperature characteristics table.

Added new Figure 2-59 to Section 2.1 “Test

Circuits”.

Corrected values in Figure 5-1.

Added description of wiper value on POR/BOR

(Section 5.2 “Wiper”).

Removed Section 8.1.

Added Section 8.4 “Implementing Log Steps

with a Linear Digital Potentiometer”.

Added Section 8.5.2.2 “Footprint Compatibil-

ity”.

10. Added Section 8.5.2.3 “PCB Area Require-

ments”.

11. Updated Table 8-2.

12. Enhanced the listing of development tools and

technical

documentation

Section 10.0

“Development support”.

13. Updated Table 10-1 and Table 10-2.

14. Updated Section 11.0 “Packaging Informa-

tion” with package available landing pattern

diagrams.

Revision A (November 2008)

• Original Release of this Document.

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