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MCP73123-22S/MF 数据表(PDF) 17 Page - Microchip Technology |
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MCP73123-22S/MF 数据表(HTML) 17 Page - Microchip Technology |
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17 / 28 page ![]() 2009-2013 Microchip Technology Inc. DS22191E-page 17 MCP73123/223 6.2 PCB Layout Issues For optimum voltage regulation, place the battery pack as close as possible to the device’s VBAT and VSS pins to minimize voltage drops along the high-current- carrying PCB traces. If the PCB layout is used as a heat sink, adding multiple vias in the heat sink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figure 6-3, Figure 6-4 and Figure 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal). FIGURE 6-5: Typical Layout (Bottom). MCP73X23EV-LFP |
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