 2002-2012 Microchip Technology Inc.

DS21446D-page 21

TC646

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

p

A

A1

A2

D

L

c

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037

.035

F

Footprint (Reference)

exceed. 010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness





c

B



7

7

.004

.010

0

.006

.012

(F)



Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

§

Overall Width

Number of Pins

Pitch

A

L

E1

D

A1

E

A2

.016

.114

.114

.022

.118

.118

.002

.030

.193

.034

MIN

p

n

Units

.026

NOM

8

INCHES

1.00

0.95

0.90

.039

0.15

0.30

.008

.016

6

0.10

0.25

0

7

7

0.20

0.40

6

MILLIMETERS*

0.65

0.86

3.00

3.00

0.55

4.90

.044

.122

.028

.122

.038

.006

0.40

2.90

2.90

0.05

0.76

MIN

MAX

NOM

1.18

0.70

3.10

3.10

0.15

0.97

MAX

8



E1

E

B

n

1

2



§ Significant Characteristic

.184

.200

4.67

.5.08

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging