IBR-I7-R-3555LE datasheet(1/3 Pages) ETC1

部件名	IBR-i7-R-3555LE

功能描述	Extreme Rugged??COM Express짰 Type 6 Module with 3rd Generation Intel짰 Core??i3/i7 Processor

PDF	3 Pages

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制造商	ETC1 [List of Unclassifed Manufacturers]

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http://www.adlinktech.com/Computer-on-Module

17

Features

Quad/dual core 3rd Generation Intel® Core™

Processor

Mobile Intel® QM77 Express Chipset

Up to 16GB ECC 1600MHz DDR3 memory in two

SODIMM sockets

Three Digital Display Interfaces (DDI) for

DisplayPort /HDMI/DVI/SDVO

Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for

graphics (or general purpose x8/4/1)

2x SATA 6 Gb/s, 2x SATA 3 Gb/s, Gigabit Ethernet,

USB 2.0, 4 USB 3.0

COM Express® COM.0 R2.1 Type 6 Pinout

Extended Temperature: -40°C to +85°C

50% Thicker PCB for high vibration environments

Express-IBR

Specifications

Core System

CPU

3rd Generation Intel® Core™ i7/i3, 22nm process, BGA type

Intel® Core™ i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB

L3 cache, 45W, quad core

Intel® Core™ i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB

L3 cache, 35W, quad core

Intel® Core™ i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB

L3 cache, 25W, dual core

Intel® Core™ i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB

L3 cache, 17W, dual core

Intel® Core™ i3-3217UE 1.6GHz, 3MB

L3 cache, 17W, dual core

Memory

Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in

dual SODIMM sockets

BIOS

AMI EFI with CMOS backup in 16 Mb SPI flash

Hardware Monitor

Supply voltages and CPU temperature

Debug Interface

XDP SFF-26 extension for ICE debug

Watchdog Timer

Programmable timer range to generate RESET

Expansion Busses

PCI Express x16 (Gen3) bus for discrete graphics solution or

general purpose PCI Express (2 x8 or 1 x8 with 2 x4)

7 PCI Express x1: Lanes 0/1/2/3/4/5/6

LPC bus, SMBus (system), I2C (user)

Technologies

PAVP 3.0, Intel® AMT 8.0, Intel® VT, Intel® AES-NI, Intel® HT,

Intel® HD Graphics with Dynamic Frequency, Intel® Turbo

Boost , Dynamic Turbo, Intel® AVX 1.0, Intel® Quick Sync Video

Video

Integrated in Processor Intel® HD Graphics 4000 at 650-1300 MHz

Integrated Video

DirectX 11.0, OpenGL 3.1, and OCL 1.1

Media Processing

Decode (HW JPEG & MJPEG decode), encode (full HW

MPEG2 encode), transcode

Intel® Clear Video HD Technology + enhanced media

processing

VGA Interface

Analog VGA support with 300 MHz DAC

Analog monitor support up to QXGA (2048 x 1536) and VGA

hot plug

LVDS Interface

Dual channel 18/24-bit LVDS

Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO

Audio

Chipset

Integrated on Mobile Intel® QM77 Express chipset

Audio Codec

Implemented on carrier board

Ethernet

Chipset

Intel® Gigabit LAN PHY WG82579LM

Speed

10/100/1000 Mbps Ethernet

Multi I/O

Chipset

Integrated on Mobile Intel® QM77 Express chipset

USB

Supports up to eight ports USB 2.0, 4 USB 3.0

SATA

Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID

0,1,5,10

Super I/O

Connected to LPC bus on carrier if needed (BIOS supports

W83627DHG)

TPM (optional)

Chipset

Atmel AT97SC3204-U1A190

Type

TPM 1.2

Power

Input Power

AT mode (12 V +/- 5%) and ATX mode

(12 V and 5 Vsb +/- 5%)

Power States

Supports S0, S1, S3, S4, S5

Power Consumption

12W typical (i7-36xxQE)

8W typical (i7-3555LE/i7-3517UE/i3-3217UE)

S3: 0.85W

S5: 0.55W

Smart Battery Support Yes (BIOS supports LTC4100 and LTC1760)

Mechanical and Environmental

Size

COM Express Basic, 125 mm x 95 mm

Board Thickness

0.093” (2.3mm)

Operating Temperature Standard: -20°C to 70°C

Extended: -40°C to 85°C

Storage Temperature

-55°C to 85°C

Humidity

90% at 60°C non-condensing

Shock

50G peak-to-peak, 11ms duration, MIL-STD-202G Method

213B

Vibration

Operating: 11.96 Grms, 50-20,000 Hz, each axis,

MIL-STD-202G Method 214A

Compatibility

PICMG COM Express COM.0 R2.1 Type 6

Certifications

CE, FCC, HALT

Operating Systems

Standard Support

Windows 7

Linux

Extended Support (BSP) Windows XPe/7, WEC 7

Linux, VxWorks 6.9, QNX 6.5

AIDI Library

Extreme Rugged™ COM Express® Type 6 Module with

3rd Generation Intel® Core™ i3/i7 Processor

类似零件编号 - IBR-i7-R-3555LE

制造商	部件名	数据表	功能描述
Sealevel Systems, Inc.	IBR-I7-3517UE	340Kb / 2P	COM Express Module, Type 6, 1.7GHz Intel Core i7

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