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TC850 数据表(PDF) 21 Page - Microchip Technology |
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TC850 数据表(HTML) 21 Page - Microchip Technology |
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21 / 30 page ![]() 2001-2012 Microchip Technology Inc. DS21479D-page 21 TC850 9.3 Package Dimensions 9.3 Package Dimensions (Continued) .015 (0.38) .008 (0.20) .620 (15.75) .590 (15.00) .700 (17.78) .620 (15.75) .540 (13.72) .510 (12.95) 2.070 (52.58) 2.030 (51.56) .210 (5.33) .170 (4.32) .020 (0.51) .016 (0.41) .110 (2.79) .090 (2.29) .065 (1.65) .045 (1.14) .200 (5.08) .125 (3.18) .098 (2.49) Max. .030 (0.76) Min. .060 (1.52) .020 (0.51) .150 (3.81) Min. 40-Pin CERDIP (Wide) Pin 1 3 ° Min. Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2.065 (52.45) 2.027 (51.49) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92) .070 (1.78) .045 (1.14) .022 (0.56) .015 (0.38) .110 (2.79) .090 (2.29) .555 (14.10) .530 (13.46) .610 (15.49) .590 (14.99) .015 (0.38) .008 (0.20) .700 (17.78) .610 (15.50) .040 (1.02) .020 (0.51) 40-Pin PDIP (Wide) Pin 1 3 ° Min. Dimensions: inches (mm) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging |
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