 2001-2012 Microchip Technology Inc.

DS21484D-page 7

TC962

5.0

PACKAGING INFORMATION

5.1

Package Marking Information

Package marking data not available at this time.

5.2

Taping Form

5.3

Package Dimensions

Component Taping Orientation for 16-Pin SOIC (Wide) Devices

W

Pin 1

User Direction of Feed

Standard Reel Component Orientation

for 713 Suffix Device

P

Package

Carrier Width (W)

Pitch (P)

Part Per Full Reel

Reel Size

16-Pin SOIC (W)

16 mm

12 mm

1000

13 in

Carrier Tape, Number of Components Per Reel and Reel Size

.400 (10.16)

.370 (9.40)

.300 (7.62)

.230 (5.84)

.065 (1.65)

.045 (1.14)

.055 (1.40) Max.

.020 (0.51) Min.

Pin 1

.200 (5.08)

.160 (4.06)

.200 (5.08)

.125 (3.18)

.110 (2.79)

.090 (2.29)

.020 (0.51)

.016 (0.41)

.040 (1.02)

.020 (0.51)

.320 (8.13)

.290 (7.37)

.150 (3.81)

Min.

3° Min.

8-Pin CDIP (Narrow)

.015 (0.38)

.008 (0.20)

.400 (10.16)

.320 (8.13)

Dimensions: inches (mm)

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging