 2002-2012 Microchip Technology Inc.

DS21459E-page 21

TC7129

44-Lead Plastic Quad Flatpack (KW) 10x10x2.0 mm Body, 1.95/0.25 mm Lead Form (PQFP)

CHAMFER VARIES

D

E1

E

p

c

B

D1

n

L

2

1

F

A1

A

A2







1.95 REF.

.077 REF.

F

Footprint

Units

INCHES

MILLIMETERS*

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

n

44

44

Pitch

p

.031 BSC

0.80 BSC

Overall Height

A

-

-

.096

-

-

2.45

Molded Package Thickness

A2

.077

.079

.083

1.95

2.00

2.10

Standoff

§

A1

.010

-

-

0.25

-

-

Foot Length

L

.029

.035

.041

0.73

0.88

1.03

Foot Angle



0°

3.5°

7°

0°

3.5°

7°

Overall Width

E

.547 BSC

13.90 BSC

Overall Length

D

.547 BSC

13.90 BSC

Molded Package Width

E1

.394 BSC

10.00 BSC

Molded Package Length

D1

.394 BSC

10.00 BSC

Lead Thickness

c

.004

-

.009

0.11

-

0.23

Lead Width

B

.012

-

.018

0.30

-

0.45

Mold Draft Angle Top



5°

-

16°

5°

-

16°

Mold Draft Angle Bottom



5°

-

16°

5°

-

16°

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.

Notes:

JEDEC Equivalent: MO-112 AA-1

Revised 07-21-05

* Controlling Parameter

§ Significant Characteristic

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

See ASME Y14.5M

Drawing No. C04-119

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging