TC7129

DS21459E-page 20

 2002-2012 Microchip Technology Inc.

44-Lead Plastic Leaded Chip Carrier (LW) – Square (PLCC)

CH2 x 45



CH1 x 45



10

5

0

10

5

0



Mold Draft Angle Bottom

10

5

0

10

5

0



Mold Draft Angle Top

0.53

0.51

0.33

.021

.020

.013

B

0.81

0.74

0.66

.032

.029

.026

B1

Upper Lead Width

0.33

0.27

0.20

.013

.011

.008

c

Lead Thickness

11

11

n1

Pins per Side

16.00

15.75

14.99

.630

.620

.590

D2

Footprint Length

16.00

15.75

14.99

.630

.620

.590

E2

Footprint Width

16.66

16.59

16.51

.656

.653

.650

D1

Molded Package Length

16.66

16.59

16.51

.656

.653

.650

E1

Molded Package Width

17.65

17.53

17.40

.695

.690

.685

D

Overall Length

17.65

17.53

17.40

.695

.690

.685

E

Overall Width

0.25

0.13

0.00

.010

.005

.000

CH2

Corner Chamfer (others)

1.27

1.14

1.02

.050

.045

.040

CH1

Corner Chamfer 1

0.86

0.74

0.61

.034

.029

.024

A3

Side 1 Chamfer Height

0.51

.020

A1

Standoff

§

A2

Molded Package Thickness

4.57

4.39

4.19

.180

.173

.165

A

Overall Height

1.27

.050

p

Pitch

44

44

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units



A2

c

E2

2

D

D1

n

#leads=n1

E

E1

1



p

A3

A

35



B1

B

D2

A1

.145

.153

.160

3.68

3.87

4.06

.028

.035

0.71

0.89

Lower Lead Width

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.

JEDEC Equivalent: MO-047

Drawing No. C04-048

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging