ADM1232

Rev. C | Page 4 of

12

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 2.

Parameter

Rating

5.5 V

Logic Inputs

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

300°C

Vapor Phase (60 sec)

215°C

Infrared (15 sec)

220°C

Power Dissipation

N-81

1000 mW

RW-16, RM-82

900 mW

R-82

900 μW

soldered in a circuit board for surface-mount packages.

Table 3. Thermal Resistance

Package Type

Unit

8-Lead PDIP (N-8)

100

°C/W

16-Lead SOIC_W (RW-16)

73

°C/W

8-Lead MSOP (RM-8)

206

°C/W

8-Lead SOIC_N (R-8)

153

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.