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ADP2302ARDZ-2.5-R7 数据表(PDF) 4 Page - Analog Devices |
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ADP2302ARDZ-2.5-R7 数据表(HTML) 4 Page - Analog Devices |
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4 / 28 page ![]() ADP2302/ADP2303 Data Sheet Rev. A | Page 4 of 28 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter MAX Rating VIN, EN, PGOOD −0.3 V to +24 V SW −1.0 V to +24 V BST to SW −0.6 V to +6 V FB, NC −0.3 V to +6 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Absolute maximum ratings apply individually only, not in combination. Unless otherwise specified, all voltages are referenced to GND. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 3. Thermal Resistance1 Package Type θJA Unit 8-Lead SOIC_N_EP 58.5 °C/W 1 JA is measured using natural convection on JEDEC 4-layer board. ESD CAUTION |
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