ADP160ACBZ-1.2-R7 datasheet(5/24 Pages) AD

5 / 24 page

Data Sheet

ADP160/ADP161/ADP162/ADP163

Rev. G | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

EN to GND

−0.3 V to VIN

ADJ to GND

−0.3 V to VIN

NC to GND

−0.3 V to VIN

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Operating Ambient Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings only apply individually; they do not

apply in combination. The ADP16x can be damaged when the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that TJ is within the specified

temperature limits. In applications with high power dissipation

and poor thermal resistance, the maximum ambient temperature

may have to be derated.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the ambient

temperature (TA) and power dissipation (PD) using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on the

application and board layout. In applications where high maximum

power dissipation exists, close attention to thermal board design

is required. The value of θJA may vary, depending on PCB material,

layout, and environmental conditions. The specified values of

θJA are based on a 4-layer, 4 inches × 3 inches, circuit board. Refer

to JESD 51-7 and JESD 51-9 for detailed information on the

board construction. For additional information, see the AN-617

Application Note, MicroCSP™ Wafer Level Chip Scale Package.

ΨJB is the junction to board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Electronic Package Thermal Information,

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package, factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

5-Lead TSOT

170

°C/W

4-Ball, 0.4 mm Pitch WLCSP

260

°C/W

ESD CAUTION

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