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SC1205CS 数据表(PDF) 6 Page - Samtec, Inc

部件名 SC1205CS
功能描述  High Speed Synchronous Power MOSFET Driver
PDF  12 Pages
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制造商  SAMTEC [Samtec, Inc]
网页  http://www.samtec.com/
标志 SAMTEC - Samtec, Inc

SC1205CS 数据表(HTML) 6 Page - Samtec, Inc

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 2004 Semtech Corp.
www.semtech.com
POWER MANAGEMENT
SC1205
Block Diagram
Applications Information
SC1205 is a high speed, smart dual MOSFET driver. It is
designed to drive Low Rds_On power MOSFET’s with
ultra-low rise/fall times and propagation delays. As the
switching frequencies of PWM controllers is increased to
reduce power supply volume and cost, fast rise and fall
times are necessary to minimize switching losses (TOP
MOSFET) and reduce Dead-time (BOTTOM MOSFET).
While Low Rds_On MOSFET’s present a power saving in
I2R losses, the MOSFET’s die area is larger and thus the
effective input gate capacitance of the MOSFET is in-
creased. Often a 50% decrease in Rds_On more than
doubles the effective input gate charge, which must be
supplied by the driver. The Rds_On power savings can
be offset by the switching and dead-time losses with a
sub_optimum driver. While discrete solutions can achieve
reasonable drive capability, implementing shoot-through
and other housekeeping functions necessary for safe
operation can become cumbersome and costly. The
SC120X family of parts presents a total solution for the
high-speed high power density applications. Wide input
supply range of 4.5V-25V allows use in battery powered
applications, new high voltage, distributed power serv-
ers as well as Class-D amplifiers.
THEORY OF OPERATION
The control input (CO) to the SC1205 is typically supplied
by a PWM controller that regulates the power supply out-
put. (See Application Evaluation Schematic, Figure 4).
The timing diagram demonstrates the sequence of events
by which the top and bottom drive signals are applied.
The shoot-through protection is implemented by holding
the bottom FET off until the voltage at the phase node
(intersection of top FET source, the output inductor and
the bottom FET drain) has dropped below 1V. This as-
sures that the top FET has turned off and that a direct
current path does not exist between the input supply
and ground. The top FET Gate Drive is turned on after
the bottom gate drive has gone low and an internal delay
time of 20ns has expired.
LAYOUT GUIDELINES
As with any high speed , high current circuit, proper lay-
out is critical in achieving optimum performance of the
SC1205. The Evaluation board schematic (Refer to fig-
ure 3) shows a two-phase synchronous design with all
surface mountable components.
While components connecting to EN are relatively non-
critical, tight placement and short, wide traces must be
used in layout of The gate drives, DRN, and especially
PGND pin. The top gate driver supply voltage is provided
by bootstrapping the +5V supply and adding it to the
phase node (DRN) voltage . Since the bootstrap capaci-
tor supplies the charge to the top gate, it must be less
than .5” away from the SC1205. Ceramic X7R capaci-
tors are a good choice for supply bypassing near the chip.
The Vcc pin capacitor must also be less than .5” away
from the SC1205. The ground node of this capacitor,



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