LM317SSLASHNOPB datasheet(6/38 Pages) TI1

6 / 38 page

LM117, LM317-N

SNVS774L – MAY 2004 – REVISED FEBRUARY 2011

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LM317A and LM317-N Electrical Characteristics

(1) (continued)

Specifications with standard type face are for TJ = 25°C, and those with boldface type apply over full Operating

Temperature Range. Unless otherwise specified, VIN − VOUT = 5V, and IOUT = 10 mA.

LM317A

LM317-N

Parameter

Conditions

Min

Typ

Max

Min

Typ

Max

Units

NDS (TO-3) Package

NDE (TO-220) Package

KTT (TO-263) Package

Thermal Resistance,

θJC

°C/W

Junction-to-Case

DCY (SOT-223) Package

23.5

NDT (TO) Package

MDT (PFM) Package

NDS (TO-3) Package

NDE (TO-220) Package

Thermal Resistance,

θJA

KTT (TO-263) Package (3)

Junction-to-Ambient (No

°C/W

DCY (SOT-223) Package (3)

140

Heat Sink)

NDT (TO) Package

186

MDT (PFM) Package (3)

103

(3)

When surface mount packages are used (TO-263, SOT-223, PFM), the junction to ambient thermal resistance can be reduced by

increasing the PC board copper area that is thermally connected to the package. See the Applications Hints section for heatsink

techniques.

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