MPX4100 SERIES

3

Motorola Sensor Device Data

Figure 2. Cross Sectional Diagram

(Not to Scale)

µ PROCESSOR

A/D

51 k

50 pF

SENSOR

OUTPUT

(PIN 1)

Figure 3. Decoupling Filter for Sensor to

Microprocessor Interface

FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD

FRAME

STAINLESS

STEEL CAP

EPOXY

PLASTIC

CASE

DIE

BOND

ABSOLUTE ELEMENT

SEALED VACUUM REFERENCE

DIE

P1

P2

Figure 2 illustrates an absolute sensing chip in the basic

chip carrier (Case 867). A fluorosilicone gel isolates the die

surface and wire bonds from the environment, while allowing

the pressure signal to be transmitted to the sensor dia-

phragm. The MPX4100A series pressure sensor operating

characteristics, and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media,

other than dry air, may have adverse effects on sensor

performance and long–term reliability. Contact the factory for

information regarding media compatibility in your application.

Figure 3 shows a typical decoupling circuit for interfacing

the integrated MAP sensor to the A/D input of a microproces-

sor. Proper decoupilng of the power supply is recommended.

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical, minimum, and maximum output curves

are shown for operation over a temperature range of 0

° to

85

°C. (The output will saturate outside of the specified pres-

sure range.)

5.0

4.5

4.0

3.5

3.0

Pressure (ref: to sealed vacuum) in kPa

TYP

MAX

MIN

2.5

2.0

1.5

1.0

0.5

0

Figure 4. Output versus Absolute Pressure

TEMP = 0 to 85

°C

20 kPa TO 105 kPa

MPX4100A

TRANSFER FUNCTION:

Vout = Vs* (.01059*P–.152) ± Error

VS = 5.1 Vdc