9

Precautions:

Lead Forming:

• TheleadsofanLEDlampmaybepreformedorcutto

lengthpriortoinsertionandsolderingonPCboard.

• For better control, it is recommended to use proper

tooltopreciselyformandcuttheleadstoapplicable

lengthratherthandoingitmanually.

• Ifmanualleadcuttingisnecessary,cuttheleadsafter

thesolderingprocess.Thesolderconnectionformsa

mechanicalgroundwhichpreventsmechanicalstress

duetoleadcuttingfromtravelingintoLEDpackage.

Thisishighlyrecommendedforhandsolderoperation,

astheexcessleadlengthalsoactsassmallheatsink.

Soldering and Handling:

• CaremustbetakenduringPCBassemblyandsoldering

processtopreventdamagetotheLEDcomponent.

• LED component may be effectively hand soldered

to PCB. However, it is only recommended under

unavoidablecircumstancessuchasrework.Theclosest

manualsolderingdistanceofthesolderingheatsource

(solderingiron’stip)tothebodyis1.59mm.Soldering

the LED using soldering iron tip closer than 1.59mm

mightdamagetheLED.

Note:

1. PCB with different size and design (component density) will have

different heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

settingisused.So,itisrecommendedtore-calibratethesoldering

profileagainbeforeloadinganewtypeofPCB.

2. AvagoTechnologies’highbrightnessLEDareusinghighefficiency

LEDdiewithsinglewirebondasshownbelow.Customerisadvised

to take extra precaution during wave soldering to ensure that the

maximumwavetemperaturedoesnotexceed250°Candthesolder

contacttimedoesnotexceeding3sec.Over-stressingtheLEDduring

solderingprocessmightcauseprematurefailuretotheLEDdueto

delamination.

Avago Technologies LED configuration

1.59mm

• ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

DorefertoAvagoapplicationnoteAN1142fordetails.

Thesolderingironusedshouldhavegroundedtipto

ensureelectrostaticchargeisproperlygrounded.

• Recommendedsolderingcondition:

Wave

Manual Solder

Dipping

Pre-heattemperature

105°CMax.

-

Preheattime

60secMax

-

Peaktemperature

250°CMax.

260°CMax.

Dwelltime

3secMax.

5secMax

Note:

1) Above conditions refers to measurement with thermocouple

mountedatthebottomofPCB.

2) Itisrecommendedtouseonlybottompreheatersinordertoreduce

thermalstressexperiencedbyLED.

• Wavesolderingparametersmustbesetandmaintained

accordingtotherecommendedtemperatureanddwell

time.Customerisadvisedtoperformdailycheckonthe

solderingprofiletoensurethatitisalwaysconforming

torecommendedsolderingconditions.

Note:ElectricalconnectionbetweenbottomsurfaceofLEDdieand

theleadframeisachievedthroughconductivepaste.

• Any alignment fixture that is being applied during

wave soldering should be loosely fitted and should

notapplyweightorforceonLED.Nonmetalmaterial

isrecommendedasitwillabsorblessheatduringwave

solderingprocess.

• At elevated temperature, LED is more susceptible to

mechanicalstress.Therefore,PCBmustallowedtocool

down to room temperature prior to handling, which

includesremovalofalignmentfixtureorpallet.

• IfPCBboardcontainsboththroughhole(TH)LEDand

othersurfacemountcomponents,itisrecommended

that surface mount components be soldered on the

topsideofthePCB.Ifsurfacemountneedtobeonthe

bottom side, these components should be soldered

usingreflowsolderingpriortoinsertiontheTHLED.

• Recommended PC board plated through holes (PTH)

sizeforLEDcomponentleads.

LED component

lead size

Diagonal

Plated through

hole diameter

0.45x0.45mm

(0.018x0.018inch)

0.636mm

(0.025inch)

0.98to1.08mm

(0.039to0.043inch)

0.50x0.50mm

(0.020x0.020inch)

0.707mm

(0.028inch)

1.05to1.15mm

(0.041to0.045inch)

• Over-sizing the PTH can lead to twisted LED after

clinching.OntheotherhandundersizingthePTHcan

causedifficultyinsertingtheTHLED.

AllnGaP Device

CATHODE