MP45DT02

Package mechanical data

Doc ID 018658 Rev 5

13/16

7

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Soldering information

The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green”

standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.

Figure 6.

Recommended soldering profile limits

Table 9.

Recommended soldering profile limits

Description

Parameter

Pb free

Average ramp rate

3 °C/sec max

Preheat

Minimum temperature

Maximum temperature

150 °C

200 °C

60 sec to 120 sec

Ramp-up rate

Time maintained above liquidous temperature

Liquidous temperature

60 sec to 150 sec

217 °C

Peak temperature

260 °C max

Time within 5 °C of actual peak temperature

20 sec to 40 sec

Ramp-down rate

6 °C/sec max

Time 25 °C (t25 °C) to peak temperature

8 minutes max

T25°C to PEAK

RAMP-DOWN

RAMP-UP

ts

PREHEAT

t

L

t

p

CRITICAL ZONE

T

T

SMAX

T

SMIN

TIME

T

P

T

L

30

60

90

120

150

180

210

240

270

300

330

360

390

AM045166v1