MPC8241EC datasheet(13/58 Pages) FREESCALE

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MPC8241 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

Electrical and Thermal Characteristics

4.4

Thermal Characteristics

Table 6 provides the package thermal characteristics for the MPC8241. For details, see Section 7.7,

“Thermal Management.”

4.5

AC Electrical Characteristics

After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 7

and tested for conformance to the AC specifications for that frequency. The processor core frequency is

determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.

Parts are sold by maximum processor core frequency. See Section 8, “Ordering Information.”

Table 6. Thermal Characterization Data

Rating

Thermal Test Board

Description

Symbol

Value 7

(166- and

200-MHz

Parts)

Value 7

(266-MHz

Part)

Unit

Notes

Junction-to-ambient natural

convection

Single-layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural

convection

Four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min) Single-layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (@200 ft/min) Four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board (bottom)

Four-layer board (2s2p)

RθJB

°C/W

Junction-to-case (top)

Single-layer board (1s)

RθJC

°C/W

Junction-to-package top

Natural convection

°C/W

Notes:

1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.

3. Per EIA/JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per EIA/JESD51-2.

7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package, which

causes the two package types to have different thermal characterization data.

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