650V CoolMOS™ C6 Power Transistor

IPx65R190C6

Thermal characteristics

Final Data Sheet

5

Rev. 2.0, 2011-05-09

3

Thermal characteristics

Table 3

Thermal characteristics non FullPAK

Parameter

Symbol

Values

Unit

Note /

Test Condition

Min.

Typ.

Max.

Thermal resistance, junction - case

R

thJC

-

-

0.83

°C/W

Thermal resistance, junction -

ambient

R

thJA

-

-

62

leaded

Soldering temperature,

wavesoldering only allowed at

leads

T

sold

-

-

260

°C

1.6 mm (0.063 in.)

from case for 10 s

Table 4

Thermal characteristics FullPAK

Parameter

Symbol

Values

Unit

Note /

Test Condition

Min.

Typ.

Max.

Thermal resistance, junction - case

R

thJC

--

3.7

°C/W

Thermal resistance, junction -

ambient

R

thJA

-

-

80

leaded

Soldering temperature,

wavesoldering only allowed at

leads

T

sold

-

-

260

°C

1.6 mm (0.063 in.)

from case for 10 s

Table 5

Thermal characteristics SMD

Parameter

Symbol

Values

Unit

Note /

Test Condition

Min.

Typ.

Max.

Thermal resistance, junction - case

R

thJC

-

-

0.83

°C/W

Thermal resistance, junction -

ambient

R

thJA

-

-

62

SMD version, device

on PCB, minimal

footprint

-

35

-

SMD version, device

on PCB, 6cm

area

1)

1) Device on 40mm*40mm*1.5mm one layer epoxy PCB FR4 with 6cm

PCB is vertical without air stream cooling.

Soldering temperature,

wave- & reflow soldering allowed

T

sold

-

-

260

°C

reflow MSL1