TOP232G datasheet(35/36 Pages) PAM

35 / 36 page

TOP232-234

7/01

Notes:

1. Package dimensions conform to JEDEC specification

MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)

package with .300 inch row spacing.

2. Controlling dimensions are inches. Millimeter sizes are

shown in parentheses.

3. Dimensions shown do not include mold flash or other

protrusions. Mold flash or protrusions shall not exceed

.006 (.15) on any side.

4. Pin locations start with Pin 1, and continue counter-clock-

wise to Pin 8 when viewed from the top. The notch and/or

dimple are aids in locating Pin 1. Pin 6 is omitted.

5. Minimum metal to metal spacing at the package body for

the omitted lead location is .137 inch (3.48 mm).

6. Lead width measured at package body.

7. Lead spacing measured with the leads constrained to be

perpendicular to plane T.

.010 (.25)

.015 (.38)

.300 (7.62) BSC

(NOTE 7)

.300 (7.62)

.390 (9.91)

.375 (9.53)

.385 (9.78)

.245 (6.22)

.255 (6.48)

.128 (3.25)

.132 (3.35)

.057 (1.45)

.063 (1.60)

.125 (3.18)

.135 (3.43)

0.15 (.38)

MINIMUM

.048 (1.22)

.053 (1.35)

.100 (2.54) BSC

.014 (.36)

.022 (.56)

-E-

Pin 1

SEATING

PLANE

-D-

-T-

P08B

DIP-8B

PI-2551-033001

D S .004 (.10)

⊕

T E D S .010 (.25) M

⊕

(NOTE 6)

SMD-8B

PI-2546-040501

.004 (.10)

.012 (.30)

.036 (0.91)

.044 (1.12)

.004 (.10)

0 -

° 8°

.375 (9.53)

.385 (9.78)

.048 (1.22)

.009 (.23)

.053 (1.35)

.032 (.81)

.037 (.94)

.128 (3.25)

.132 (3.35)

-D-

Notes:

1. Controlling dimensions are

inches. Millimeter sizes are

shown in parentheses.

2. Dimensions shown do not

include mold flash or other

protrusions. Mold flash or

protrusions shall not exceed

.006 (.15) on any side.

3. Pin locations start with Pin 1,

and continue counter-clock

Pin 8 when viewed from the

top. Pin 6 is omitted.

4. Minimum metal to metal

spacing at the package body

for the omitted lead location

is .137 inch (3.48 mm).

5. Lead width measured at

package body.

6. D and E are referenced

datums on the package

body.

.057 (1.45)

.063 (1.60)

(NOTE 5)

E S

.100 (2.54) (BSC)

.372 (9.45)

.245 (6.22)

.388 (9.86)

.255 (6.48)

.010 (.25)

-E-

Pin 1

D S .004 (.10)

⊕

G08B

Heat Sink is 2 oz. Copper

As Big As Possible

.420

.046 .060

.060 .046

.080

Pin 1

.086

.186

.286

Solder Pad Dimensions

TOP232G 数据表(PDF) 35 Page - Power Analog Micoelectronics

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TOP232G 数据表(PDF) 35 Page - Power Analog Micoelectronics

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