IEC

EIA

Dimensions

Dimension Description

Mark

Mark

Dimensions

Tolerance

Carrier tape width

W

W

18

-0.5/+1.0

(.709)

(-0.02/+.039)

Hold down tape width

W4

11

min.

W0

(.433)

Hold down tape

No protrusion

Top distance between tape edges

W2

W6

3

max.

(.118)

Sprocket hole position

W1

W5

9

-0.5/+0.75

(.354)

(-0.02/+0.03)

Sprocket hole diameter

D0

D0

4

±0.2

(.157)

(±.0078)

Abscissa to plane (straight lead)

H

H

18.5

±3.0

(.728)

(±.118)

Abscissa to plane (kinked lead)

H0

H0

16

±0.5

(.63)

(±.02)

Abscissa to top (straight lead)

H1

H1

38.0

max.

(1.496)

Abscissa to top (kinked lead)

H1

H1

32.2

max.

(1.268)

Overall width w/lead protrusion (straight lead)

C1

55.0

max.

(2.165)

Overall width w/lead protrusion (kinked lead)

C1

43.2

max.

(1.7)

Overall width w/o lead protrusion (straight lead)

C2

54.0

max.

(2.126)

Overall width w/o lead protrusion (kinked lead)

C2

42.5

max.

(1.673)

Lead protrusion

I1

L1

1.0

max.

(.039)

Protrusion of cutout

L

L

11

max.

(.433)

Protrusion beyond hold-down tape

I2

I2

Not specified

Sprocket hole pitch

P0

P0

12.7

±0.3

(0.5)

(±.012)

Pitch tolerance

20 consecutive

±1

(±.039)

Device pitch: MF-R005–MF-R160, MF-R/90,

MF-RX110/72–MF-RX185/72

12.7

±0.3

(0.5)

(±.012)

Device pitch: MF-R185–MF-R400, MF-RX110–MF-RX375

MF-R/600, MF-RX250/72–MF-RX375/72

25.4

±0.6

(1.0)

(±.024)

Tape thickness

t

t

0.9

max.

(.035)

Tape thickness with splice: MF-R010–MF-R160,

t1

max.

MF-RX110/72–MF-RX185/72

1.5

(.059)

Tape thickness with splice: MF-R250–MF-R1100,

t1

max.

MF-RX110–MF-RX375, MF-R/90, MF-RX250/72-MF-RX375/72

2.3

(.091)

Splice sprocket hole alignment

0

±0.3

(±.012)

Body lateral deviation

Δh

Δh

0

±1.0

(±.039)

Body tape plane deviation

Δp

Δp

0

±1.3

(±.051)

MF-R, MF-R/90, MF-R/600, MF-RX, MF-RX/72 & MF-RX/250 Series

Tape and Reel Specifications

Specifications are subject to change without notice.

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.

Users should verify actual device performance in their specific applications.

Devices taped using EIA468–B/IEC286-2 standards. See table below and Figures 1 and 2 for details.

DIMENSIONS:

MM

(INCHES)