Notice for General Usage -MHz Chip Type-

Please mount component on a circuit board by reflow

soldering. Flow soldering is not acceptable.

1. Soldering

Conformal coating or washing of the component is not

acceptable, because it is not hermetically sealed.

Please contact us if you need a washable component.

2. Washing / Coating

(1) Reflow soldering

Recommendable Flux and Solder

If compelled to mount the component by using soldering

iron, please do not directly touch the component with the

soldering iron. The component terminals or electrical

characteristics may be damaged if excessive thermal

stress is applied.

(2) Soldering with Iron

Please make the solder volume less than the height of

the substrate to avoid damage to the seal between the

metal cap and the substrate.

(3) Solder Volume

Do not reuse components removed from a circuit board

after soldering.

(4) Other

The component is recommended with placement machines

that employ optical placement capabilities. The component

may be damaged by excessive mechanical force. Please

make sure that you have evaluated by using placement

machines before going into mass production. Do not use

placement machines that utilize mechanical positioning.

Please contact Murata for details beforehand.

(5) Conditions for Placement Machines

150

180

220

245

260

Gradual

Cooling

Peak

Pre-heating

(150 to 180°C)

Heating

(220°C min.)

60 to 120s

30 to 60s

Flux

Solder

Please use rosin based flux,

not water soluble flux.

Recommendable Soldering Profile

Pre-heating

Heating

Peak Temperature

150 to 180°C

Please use solder (Sn-3.0Ag-0.5Cu) under

the following conditions: Standard thickness

of soldering paste: 0.10 to 0.15mm.

220°C min.

upper limit: 260°C

lower limit: 245°C

60 to 120s

30 to 60s

1s max.

5s max.

Temperature shall be measured on the surface of component.

Recommendable Soldering with Iron

Heating of the soldering iron

Watt

Shape of the soldering iron

350°C max.

30W max.

ø3mm max.

5s max. at one terminal

Sn-3.0Ag-0.5Cu

Soldering Time

Solder

c Soldering and Mounting (CSTCR/CSTCE_V/CSTCG/CSTCE_G Series)

Continued on the following page.

P16E.pdf

Nov.22,2012

34

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.