Characteristics

STPS1045B

4/7

Doc ID 6085 Rev 6

Figure 7.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 8.

Junction capacitance versus

reverse voltage applied

(typical values)

0

5

10

15

20

25

30

35

40

45

1E-1

1E+0

1E+1

1E+2

1E+3

1E+4

1E+5

I (µA)

R

V (V)

R

T =125°C

j

T =150°C

j

T =100°C

j

T =50°C

j

T =25°C

j

T =75°C

j

12

5

10

20

50

100

200

500

1000

C(pF)

V (V)

R

F=1MHz

V

=30mV

T =25°C

OSC

RMS

j

Figure 9.

Forward voltage drop versus

forward current

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under tab

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

T =25°C

(maximum values)

j

I

(A)

FM

V

(V)

FM

0

2

4

6

8

10121416

1820

0

20

40

60

80

100

Rth(j-a)(°C/W)

S(Cu)(cm )

2

Epoxy printed circuit board, copper thickness: 35 µm