100

Revised: August 31, 2011

© 2011 Littelfuse, Inc.

250R Series

Radial Leaded > 250R Series

Specifications are subject to change without notice.

Please refer to www.littelfuse.com/series/250R.html for current information.

Environmental Specifications

Operating/Storage

Temperature

Maximum Device Surface

Temperature in Tripped State

Passive Aging

Humidity Aging

Thermal Shock

Solvent Resistance

Moisture Sesitivity Level

Physical Specifications

Lead Material

Tin-plated Copper

Soldering

Characteristics

Method 208E

Insulating Material

Device Labeling

and date code.

Soldering Parameters - Wave Soldering

Condition

PeakTemp/ DurationTime

< 5 Sec

> 220°C

2 Sec ~ 20 Sec

Preheat 140°C ~ 180°C

180 Sec ~ 210 Sec

Storage Condition

<

N

side of the board.

and solvents.

Note:

profile, devices may not meet the performance

requirements.

Preheating

160

190

220

260

0

2 to 5

Soldering

Cooling

20-30

180 to 210

Time(s)