AD8641/AD8642/AD8643

Data Sheet

Rev. E | Page 14 of 16

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.10

0.23

0.09

3.20

3.00

2.80

5.15

4.90

4.65

PIN 1

IDENTIFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

Figure 46. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AB

14

8

7

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

8.75 (0.3445)

8.55 (0.3366)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COPLANARITY

0.10

8°

0°

45°

Figure 47. 14-Lead Standard Small Outline Package [SOIC_N]

(R-14)

Dimensions shown in millimeters and (inches)

EXCEPT FOR EXPOSED PAD DIMENSION.

1

0.50

BSC

0.60 MAX

PIN 1

INDICATOR

1.50 REF

0.50

0.40

0.30

0.25 MIN

0.45

2.75

BSC SQ

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

0.90

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

3.00

BSC SQ

*1.65

1.50 SQ

1.35

16

5

13

8

9

12

4

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad (CP-16-3)

Dimensions shown in millimeters