Data Sheet

AD8641/AD8642/AD8643

Rev. E | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Absolute maximum ratings apply at 25°C, unless otherwise noted.

Table 3.

Parameter

Rating

Supply Voltage

27.3 V

Input Voltage

VS− to VS+

Differential Input Voltage

±Supply Voltage

Output Short-Circuit Duration

Indefinite

Storage Temperature Range

KS-5, R-8, RM-8, R-14, CP-16 Packages

−65°C to +150°C

Operating Temperature Range

−40°C to +125°C

Junction Temperature Range

KS-5, R-8, RM-8, R-14, CP-16 Packages

−65°C to +150°C

Lead Temperature (Soldering, 60 sec)

300°C

soldered in a circuit board for surface-mount packages. This

was measured using a standard 4-layer board. For the LFCSP

package, solder the exposed pad to a copper plane, which

should be connected to V+.

Table 4.

Package Type

Unit

5-Lead SC70 (KS)

430

149

°C/W

8-Lead SOIC (R)

121

43

°C/W

8-Lead MSOP (RM)

142

45

°C/W

14-Lead SOIC (R)

110

36

°C/W

16-Lead LFCSP (CP)

81

16

°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION