P16E.pdf

Jul.15,2011

Please mount component on a circuit board by re-flow

soldering. Flow soldering is not acceptable.

1. Soldering

(1) Re-flow soldering

Recommendable Flux and Solder

Be compelled to mount component by using soldering

iron, please do not directly touch the component with

soldering iron. The terminals of component or electrical

characteristics may be damaged if excess thermal stress

is applied.

(2) Soldering with Iron

Do not reuse removed component from a circuit board

after soldering.

(3) etc.

The component is recommended with placement

machines with employ optical placement capabilities. The

component might be resulted in damage by excessive

mechanical force. Please make sure that you have

evaluated by using placement machines before going into

mass production. Do not use placement machines which

utilize mechanical positioning. Please contact Murata for

details beforehand.

(4) Condition for Placement Machines

150

180

220

245

260

Gradual

Cooling

Peak

Pre-heating

(150 to 180

°C)

Heating

(220

°C min.)

60 to 120s

30 to 60s

Flux

Solder

Please use rosin based flux,

but do not use water soluble flux.

Recommendable Soldering Profile

Pre-heating

Heating

Peak Temperature

150 to 180

°C

Please use solder (Sn-3.0Ag-0.5Cu) under

the following condition. Standard thickness

of soldering paste: 0.10 to 0.15mm

220

°C min.

upper limit: 260

°C

lower limit: 245

°C

60 to 120s

30 to 60s

1s max.

5s max.

Temperature shall be measured on the surface of component.

Recommendable Soldering with Iron

Heating of the soldering iron

Watt

Shape of the soldering iron

350

°C max.

30W max.

ø3mm max.

5s max. at one terminal

Sn-3.0Ag-0.5Cu

Soldering Time

Solder

Continued on the following page.

HCFC, Isopropanol, Tap water, Demineralized water,

Cleanthrough750H, Pine alpha 100S, Techno care FRW

2. Wash

(1) Cleaning Solvents

dT

V60°C (dT=Component-solvent)

*1 ex. In case the component at +90

°C immerses into

cleaning solvent at +60

°C, then dT=30°C.

(2) Temperature Difference : dT *1

s Soldering and Mounting (CSTCV/CSACV Series)

Notice for Automotive

14

2

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.