8

Figure 7. Radiation Pattern.

Figure 9. Recommended wave soldering profile.

Figure 6. Forward voltage shift vs. temperature.

Figure 8. Recommended Pb-free reflow soldering profile.

Figure 10. Recommended soldering pad pattern.

217 C

200 C

60-120SEC.

6 C/SEC. MAX.

3 C/SEC. MAX.

(Acc. to J-STD-020C)

3 C/SEC. MAX.

150 C

255 - 260 C

100 SEC. MAX.

10 to 30 SEC.

TIME

LAMINAR WAVE

BOTTOM SIDE

OF PC BOARD

HOT AIR KNIFE

TURBULENT WAVE

FLUXING

PREHEAT

0

10

20

30

50

100

150

200

250

30

40

50

TIME – SECONDS

60

70

80

90

100

TOP SIDE OF

PC BOARD

CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)

PREHEAT SETTING = 150C (100C PCB)

SOLDER WAVE TEMPERATURE = 245C

AIR KNIFE AIR TEMPERATURE = 390C

AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)

AIR KNIFE ANGLE = 40

LEADED SOLDER: SN63; FLUX: RMA

LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu

NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED

BEFORE EXERTING MECHANICAL FORCE.

Note: For detail information on reflow soldering of Avago surface

mount LEDs, do refer to Avago Application Note AN 1060 Surface

Mounting SMT LED Indicator Components.

HSMx-A100 g 6

1.0

0

ANGULAR DISPLACEMENT – DEGREES

0.8

0.6

0.2

0.4

-70

-50

-30

0

20 30

50

70

90

-90

-20

-80

-60

-40

-10

10

40

60

80

-0.3

-100

TEMPERATURE – °C

0.5

0.4

0.2

0.1

0

-0.2

150

50

-50

0

100

-0.1

0.3

GaP/AlGaAs/

AlInGaP

InGaN/GaN

2.60

4.50

1.50

SOLDER RESIST