ADP124ARHZ-2.8-R7 datasheet(5/20 Pages) AD

5 / 20 page

Data Sheet

ADP124/ADP125

Rev. C | Page 5 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6.5 V

ADJ to GND

−0.3 V to +6.5 V

EN to GND

−0.3 V to +6.5 V

VOUT to GND

−0.3 V to VIN

Storage Temperature Range

−65°C to +150°C

Operating Ambient Temperature Range

−40°C to +85°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination. The ADP124/ADP125 can be damaged when the

junction temperature limits are exceeded. Monitoring ambient

temperature does not guarantee that TJ will remain within the

specified temperature limits. In applications with high power

dissipation and poor thermal resistance, the maximum ambient

temperature may have to be limited.

In applications with moderate power dissipation and low PCB

thermal resistance, the maximum ambient temperature can

exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature (TJ) of

the device is dependent on the ambient temperature (TA), the

power dissipation of the device (PD), and the junction-to-ambient

thermal resistance of the package (θJA).

Maximum junction temperature (TJ) is calculated from the

ambient temperature (TA) and power dissipation (PD) using the

formula

TJ = TA + (PD × θJA)

The junction-to-ambient thermal resistance (θJA) of the package

is based on modeling and calculation using a 4-layer board. The

junction-to-ambient thermal resistance is highly dependent on the

application and board layout. In applications in which high maxi-

mum power dissipation exists, close attention to thermal board

design is required. The value of θJA may vary, depending on PCB

material, layout, and environmental conditions. The specified

values of θJA are based on a 4-layer, 4 inch × 3 inch circuit board.

Refer to JESD 51-7 for detailed information on the board

construction.

ΨJB is the junction-to-board thermal characterization parameter

and is measured in °C/W. The ΨJB of the package is based on

modeling and calculation using a 4-layer board. The Guidelines for

Reporting and Using Package Thermal Information: JESD51-12

states that thermal characterization parameters are not the same

as thermal resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package—factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed information

about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

8-Lead MSOP

102.8

31.8

°C/W

8-Lead LFCSP

68.9

44.1

°C/W

ESD CAUTION

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