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ADP122ACPZ-2.5-R7 数据表(PDF) 15 Page - Analog Devices |
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ADP122ACPZ-2.5-R7 数据表(HTML) 15 Page - Analog Devices |
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15 / 24 page ![]() Data Sheet ADP122/ADP123 Rev. E | Page 15 of 24 JUNCTION TEMPERATURE CALCULATIONS FOR TSOT PACKAGE 140 120 100 80 60 40 20 0 0.5 1.0 1.5 2.0 2.5 3.0 VOUT – VIN (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 25mA ILOAD = 100mA ILOAD = 150mA ILOAD = 300mA TJ MAX Figure 38. Junction Temperature vs. Power Dissipation, 500 mm2 of PCB Copper, TA = 25°C 140 120 100 80 60 40 20 0 VOUT – VIN (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 25mA ILOAD = 100mA ILOAD = 150mA ILOAD = 300mA TJ MAX 0.5 1.0 1.5 2.0 2.5 3.0 Figure 39. Junction Temperature vs. Power Dissipation, 100 mm2 of PCB Copper, TA = 25°C 140 120 100 80 60 40 20 0 VOUT – VIN (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 25mA ILOAD = 100mA ILOAD = 150mA ILOAD = 300mA TJ MAX 0.5 1.0 1.5 2.0 2.5 3.0 Figure 40. Junction Temperature vs. Power Dissipation, 0 mm2 of PCB Copper, TA = 25°C 140 120 100 80 60 40 20 0 VOUT – VIN (V) ILOAD = 1mA ILOAD = 10mA ILOAD = 25mA ILOAD = 100mA ILOAD = 150mA ILOAD = 300mA TJ MAX 0.5 1.0 1.5 2.0 2.5 3.0 Figure 41. Junction Temperature vs. Power Dissipation, 500 mm2 of PCB Copper, TA = 50°C |
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