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ADP122ACPZ-3.3-R7 数据表(PDF) 17 Page - Analog Devices |
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ADP122ACPZ-3.3-R7 数据表(HTML) 17 Page - Analog Devices |
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17 / 24 page ![]() Data Sheet ADP122/ADP123 Rev. E | Page 17 of 24 JUNCTION TEMPERATURE CALCULATIONS FOR LFCSP PACKAGE 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 TJ MAX VOUT – VIN (V) 25mA 100mA 150mA 300mA 1mA 10mA Figure 45. Junction Temperature vs. Power Dissipation, 500 mm2 of PCB Copper, TA = 25°C 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 TJ MAX VOUT – VIN (V) 25mA 100mA 150mA 300mA 1mA 10mA Figure 46. Junction Temperature vs. Power Dissipation, 100 mm2 of PCB Copper, TA = 25°C 3.0 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 TJ MAX VOUT – VIN (V) 25mA 100mA 150mA 300mA 1mA 10mA Figure 47. Junction Temperature vs. Power Dissipation, 500 mm2 of PCB Copper, TA = 50°C 0 20 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 TJ MAX VOUT – VIN (V) 25mA 100mA 150mA 300mA 1mA 10mA 40 Figure 48. Junction Temperature vs. Power Dissipation, 100 mm2 of PCB Copper, TA = 50°C |
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