数据搜索系统，热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

预览 PDF HTML

ADP125ACPZ-R7 数据表(PDF) 15 Page - Analog Devices

部件名 ADP125ACPZ-R7
功能描述  5.5 V Input, 500 mA, Low Quiescent Current, CMOS Linear Regulators
PDF  20 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP125ACPZ-R7 数据表(HTML) 15 Page - Analog Devices

Back Button ADP125ACPZ-R7 Datasheet HTML 11Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 12Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 13Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 14Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 15Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 16Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 17Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 18Page - Analog Devices ADP125ACPZ-R7 Datasheet HTML 19Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 15 / 20 page
background image
Data Sheet
ADP124/ADP125
Rev. C | Page 15 of 20
JUNCTION TEMPERATURE CALCULATIONS
25
35
45
55
65
75
85
95
105
115
125
135
145
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 36. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 25°C
25
35
45
55
65
75
85
95
105
115
125
135
145
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 37. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 25°C
50
60
70
80
90
100
110
120
130
140
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 38. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 50°C
50
60
70
80
90
100
110
120
130
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
TOTAL POWER DISSIPATION (W)
6400 mm2
500 mm2
25 mm2
TJ MAX
Figure 39. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 50°C
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.25
0.50
0.75
1.00
1.25
1.50
1.75
2.00
2.25
2.50
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 40. Junction Temperature vs. Power Dissipation, MSOP package
at various Board Temperatures
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 41. Junction Temperature vs. Power Dissipation, LFCSP package
at various Board Temperatures



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com