Data Sheet

ADP150

Rev. B | Page 17 of 20

PCB LAYOUT CONSIDERATIONS

Heat dissipation from the package can be improved by

increasing the amount of copper attached to the pins of the

ADP150. However, as listed in Table 7, a point of diminishing

returns is reached eventually, beyond which an increase in the

copper size does not yield significant heat dissipation benefits.

Place the input capacitor as close as possible to the VIN and

GND pins. Place the output capacitor as close as possible to the

VOUT and GND pins. Use of 0402 size or 0603 size capacitors

and resistors achieves the smallest possible footprint solution on

boards where area is limited.

Figure 47. Example TSOT PCB Layout

Figure 48. Example WLCSP PCB Layout