Data Sheet

ADL5545

Rev. 0 | Page 7 of 20

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

6.5 V

Input Power (50 Ω Impedance)

18 dBm

Internal Power Dissipation

(Pad Soldered to Ground)

400 mW

Maximum Junction Temperature

150°C

Operating Temperature Range

−40°C to +105°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

Table 4. Thermal Resistance

Package Type

θJA1

θJC2

Unit

3-Lead SOT-89 (RK-3)

53

15

°C/W

1

Measured on the ADL5545 evaluation board. For more information about

board layout, see the Soldering Information and Recommended PCB Land

Pattern section.

2

Based on simulation with a standard JEDEC board per JESD51.

ESD CAUTION