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AD5301 数据表(PDF) 20 Page - Analog Devices |
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AD5301 数据表(HTML) 20 Page - Analog Devices |
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20 / 24 page ![]() AD5304/AD5314/AD5324 Data Sheet Rev. H | Page 20 of 24 POWER SUPPLY BYPASSING AND GROUNDING In any circuit where accuracy is important, careful consideration of the power supply and ground return layout helps to ensure the rated performance. The printed circuit board on which the AD5304/AD5314/AD5324 is mounted is designed so that the analog and digital sections are separated and confined to certain areas of the board. If the AD5304/AD5314/AD5324 are in a system where multiple devices require an AGND-to-DGND connection, the connection is made at one point only. The star ground point is established as close as possible to the device. The AD5304/AD5314/AD5324 has ample supply bypassing of 10 μF in parallel with 0.1 μF on the supply located as close to the package as possible, ideally right up against the device. The 10 μF capacitors are the tantalum bead type. The 0.1 μF capacitor has low effective series resistance (ESR) and effective series inductance (ESI), like the common ceramic types that provide a low impedance path to ground at high frequencies, to handle transient currents due to internal logic switching. The power supply lines of the AD5304/AD5314/AD5324 use as large a trace as possible to provide low impedance paths and reduce the effects of glitches on the power supply line. Fast switching signals such as clocks are shielded with digital ground to avoid radiating noise to other parts of the board, and are never run near the reference inputs. Avoid crossover of digital and analog signals. Traces on opposite sides of the board run at right angles to each other. This reduces the effects of feedthrough through the board. A microstrip technique is by far the best, but is not always possible with a double-sided board. In this technique, the component side of the board is dedicated to a ground plane while signal traces are placed on the solder side. Table 7. Overview of AD53xx Serial Devices Part No. Resolution No. of DACs DNL Interface Settling Time (μs) Package Pins SINGLES AD5300 8 1 ±0.25 SPI 4 SOT-23, MSOP 6, 8 AD5310 10 1 ±0.5 SPI 6 SOT-23, MSOP 6, 8 AD5320 12 1 ±1.0 SPI 8 SOT-23, MSOP 6, 8 AD5301 8 1 ±0.25 2-Wire 6 SOT-23, MSOP 6, 8 AD5311 10 1 ±0.5 2-Wire 7 SOT-23, MSOP 6, 8 AD5321 12 1 ±1.0 2-Wire 8 SOT-23, MSOP 6, 8 DUALS AD5302 8 2 ±0.25 SPI 6 MSOP 8 AD5312 10 2 ±0.5 SPI 7 MSOP 8 AD5322 12 2 ±1.0 SPI 8 MSOP 8 AD5303 8 2 ±0.25 SPI 6 TSSOP 16 AD5313 10 2 ±0.5 SPI 7 TSSOP 16 AD5323 12 2 ±1.0 SPI 8 TSSOP 16 QUADS AD5304 8 4 ±0.25 SPI 6 MSOP, LFCSP 10 AD5314 10 4 ±0.5 SPI 7 MSOP, LFCSP 10 AD5324 12 4 ±1.0 SPI 8 MSOP, LFCSP 10 AD5305 8 4 ±0.25 2-Wire 6 MSOP 10 AD5315 10 4 ±0.5 2-Wire 7 MSOP 10 AD5325 12 4 ±1.0 2-Wire 8 MSOP 10 AD5306 8 4 ±0.25 2-Wire 6 TSSOP 16 AD5316 10 4 ±0.5 2-Wire 7 TSSOP 16 AD5326 12 4 ±1.0 2-Wire 8 TSSOP 16 AD5307 8 4 ±0.25 SPI 6 TSSOP 16 AD5317 10 4 ±0.5 SPI 7 TSSOP 16 AD5327 12 4 ±1.0 SPI 8 TSSOP 16 OCTALS AD5308 8 8 ±0.25 SPI 6 TSSOP 16 AD5318 10 8 ±0.5 SPI 7 TSSOP 16 AD5328 12 8 ±1.0 SPI 8 TSSOP 16 |
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