Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

CM45, CM32, CM25, CM20, CM16, CM10 SMT Chip Inductors

Packaging Specifications

Packaging

Reel Dimensions

Model

A

B

W

F

E

P1

P2

P3

¿D0

¿D1

t1

t2

CM10

0.71 (.027) 1.21 (.047) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)

2.00 (.079)

4.00 (.157)

1.50 (.059) 0.60 (.024)

0.27 (.011)

1.20 (.047)

CM16

1.00 (.039) 1.80 (.071) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)

2.00 (.079)

4.00 (.157)

1.50 (.059) 0.60 (.024)

0.27 (.011)

1.20 (.047)

CM20

1.45 (.057) 2.25 (.089) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)

2.00 (.079)

4.00 (.157)

1.50 (.059) 1.00 (.039)

0.25 (.010)

1.55 (.061)

CM25

2.40 (.094) 2.90 (.114) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)

2.00 (.079)

4.00 (.157)

1.50 (.059) 1.10 (.043)

0.25 (.010)

1.85 (.073)

CM32

2.80 (.110) 3.60 (.142) 8.00 (.315) 3.50 (.138) 1.75 (.069) 4.00 (.157)

2.00 (.079)

4.00 (.157)

1.50 (.059)

—

0.25 (.010)

2.40 (.094)

CM45

3.60 (.142) 4.90 (.193) 12.00 (.472) 5.50 (.217) 1.75 (.069) 8.00 (.315)

2.00 (.079)

4.00 (.157)

1.50 (.059)

—

0.30 (.012)

3.50 (.138)

CM10, CM16, CM20, CM25, CM32

CM45

Model

A

B

C

D

E

W

CM10

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079)

9 (.354)

CM16

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079)

9 (.354)

CM20

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079)

9 (.354)

CM25

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079)

9 (.354)

CM32

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079)

9 (.354)

CM45

178 (7.008)

60 min. 13 (.512)

21 (.827)

2 (.079) 13 (.512)

Model

Quantity

Weight

CM10

10000 pcs

150 g

CM16

3000 pcs

90 g

CM20

3000 pcs

90 g

Model

Quantity

Weight

CM25

2000 pcs

100 g

CM32

2000 pcs

190 g

CM45

500 pcs

100 g

Soldering

Flow Soldering

Infrared Soldering

Vapor-phase Soldering

Flow Soldering

260 °C maximum for 5 seconds (2 wave solder method)

Infrared

200 °C for a maximum of 30 seconds. Peak of 240 °C for a maximum of 5 seconds.

If the solder does not reflow simultaneously under each terminal, there may be a misalignment of the component on the

board. For this reason, it is recommended that the inductor be adhered to the board prior to reflow.

Vapor-phase

215 °C for a maximum of 30 seconds.

10 seconds max.

260 °C

Preheat:

100 to 150 °C

2 minutes

min.

Preheat:

100 to 150 °C

2 minutes

min.

10 seconds max.

230 °C

200 °C

30 seconds max.

Preheat:

100 to 150 °C

2 minutes

min.

10 seconds max.

220 °C

215 °C

30 seconds max.

B

A

W

D

C

E

P1

P2

P3

A

D1

DIA.

B

ØDo

W

F

E

t2

t1

Tape running direction

Chip

Component

P1

P2

P3

A

B

ØDo

W

F

E

t2

t1

Chip

Component

Tape running direction