BAT30 datasheet(4/14 Pages) STMICROELECTRONICS

4 / 14 page

Characteristics

BAT30

4/14

Doc ID 12564 Rev 3

Figure 5.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

Figure 6.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

Figure 7.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

Figure 8.

Thermal resistance junction to

ambient versus copper surface

under each lead (SOD-923)

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SOT-666

(s)

th(j-a)/Rth(j-a)

Epoxy printed board FR4

Coppr thickness = 35 µm

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

th(j-a)/Rth(j-a)

Single pulse

SOD-923

(s)

1.E-03

1.E-02

1.E-01

1.E+00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

Single pulse

SOD-523

th(j-a)/Rth(j-a)

(s)

Epoxy printed board FR4

Coppr thickness = 35 µm

100

200

300

400

500

600

700

800

900

0.00.2

0.4

0.60.8

1.0

1.2

1.4

1.6

1.8

2.0

Epoxy printed board FR4

Copper thichness = 35 µm

SCU(cm²)

th(j-a)(°C/W)

Figure 9.

Thermal resistance junction to

ambient versus copper surface

under each lead (SOD-323)

Figure 10.

Leakage current versus reverse

applied voltage (typical values)

200

300

400

500

600

th(j-a)(°C/W)

SCU(mm²)

Epoxy printed board FR4

Copper thichness = 35 µm

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

j=150°C

j=25°C

j=85°C

j=125°C

VR (V)

IR (µA)

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