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EP2C50 数据表(PDF) 21 Page - Altera Corporation |
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EP2C50 数据表(HTML) 21 Page - Altera Corporation |
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21 / 182 page ![]() Package Information Datasheet for Mature Altera Devices 21 Device and Package Cross Reference © December 2011 Altera Corporation Package Information Datasheet for Mature Altera Devices Excalibur Devices Table 22 lists the device name, package type, and number of pins for the Excalibur device family. 1 The package type entries with “Option #” refer to instances where multiple package options exist for a given package type and pin count. The option number identifies the specific type used by the corresponding device density. EPF6016 TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 256 EPF6016A TQFP, Wire Bond 100 FBGA, Wire Bond 100 TQFP, Wire Bond 144 PQFP, Wire Bond 208 FBGA, Wire Bond, Option 1 256 EPF6024A TQFP, Wire Bond 144 PQFP, Wire Bond 208 PQFP, Wire Bond 240 BGA, Wire Bond, Option 2 256 FBGA, Wire Bond, Option 1 256 EPF8282A PLCC, Wire Bond 84 TQFP, Wire Bond 100 EPF8452A TQFP, Wire Bond 100 PQFP, Wire Bond 160 Table 21. FLEX 10KE Devices (Part 3 of 3) Device Package Pins Table 22. Excalibur Devices Device Package Pins EPXA1 FBGA, Wire Bond, Option 2 484 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 EPXA4 Dual-Piece Lid: FBGA, Flip Chip, Option 1 672 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 EPXA10 Dual-Piece Lid: FBGA, Flip Chip, Option 1 1020 |
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